NLIR1280L | Thermal Camera Cores for UAV Payloads

The NLIR1280L uncooled infrared core module represents the premier performance tier in high-definition Thermal Camera Cores. Engineered specifically for precision telemetry within drone gimbals, autonomous ADAS platforms, and industrial sensors, this module delivers mission-critical 1280×1024 infrared imaging with uncompromised structural efficiency.

  • SWaP Advantage: 24.5g Ultralight Mass | 29mm × 29mm × 18.9mm Micro Framework optimized for space-constrained payloads.
  • Environmental Resilience: Athermalized Optics ensure diffraction-limited clarity across extreme temperature fluctuations.
  • High-Speed Dynamics: Native 30Hz frame rate guarantees fluid, real-time tracking telemetry.

1. Product Description | Thermal Camera Cores for UAV Payloads

As the industry’s most compact high-definition imaging engine, the NLIR1280L represents the pinnacle of uncooled Thermal Camera Cores. Engineered explicitly for size-constrained integration in UAV payloads (drones) and autonomous ADAS applications, this module is powered by a state-of-the-art 12μm pixel pitch longwave infrared (LWIR) detector, delivering a native 1280×1024 HD array for unparalleled thermal clarity.

Beyond its unmatched SWaP (Size, Weight, and Power) footprint, the NLIR1280L architecture is built for universal compatibility. It provides hardware integrators with versatile serial communication protocols and multiple digital video output interfaces, pairing seamlessly with our curated selection of lightweight athermalized infrared lenses. Whether deployed in rugged electro-optical tracking pods, low-visibility vision enhancement systems, automated machine vision setups, or rigorous scientific research, the NLIR1280L serves as the ultimate thermal sensor for demanding, mission-critical environments.

Strategic Target Application Domains

  • Drones & UAVs: Acts as the primary telemetry payload for drone gimbals and heavy-lift industrial aerial systems.
  • Automotive ADAS: Provides high-definition infrared vision enhancement for next-generation advanced driver assistance systems.
  • Electro-Optical Pods: Integrates seamlessly into multi-sensor gyrostabilized gimbals and tracking pods.
  • Vision Enhancement & Machine Vision: Delivers high-precision thermal analytics for automated manufacturing inspection and vision enhancement.
  • Scientific Research: Provides raw, uncompressed thermal metadata essential for laboratory imaging and scientific research.

2. Lens Selection Matrix for Thermal Camera Cores

Table 2.1 Lens Parameters

Array FormatFocal Length / F#Lens TypeFOV (H×V)IFOV
1280×102410mm F1.2Athermalized78°×64.9°1.200 mrad
1280×102435mm F1.0Athermalized25.1°×20.1°0.7 mrad
1280×102450mm F1.2Athermalized17.4°×14°0.240 mrad
1280×102475mm F1.2Athermalized11.67°×9.35°0.160 mrad

3. Product Performance Parameters of LWIR Thermal Camera Cores

Table 3.1 Product Performance Parameters

ItemImaging VersionTemperature Measurement Version
Detector TypeVOx uncooled infrared FPAVOx uncooled infrared FPA
Resolution1280×10241280×1024
Pixel Pitch12μm12μm
Frame Rate30Hz30Hz
Spectral Band8–14μm8–14μm
NETD≤50mK @25℃, F/1.0≤50mK @25℃, F/1.0
Brightness/ContrastManual / AutoManual / Auto
PolarityBlack Hot / White HotBlack Hot / White Hot
Pseudo ColorSupported(1)Supported(1)
Image ProcessingTECless NUC, Digital Filter, DDETECless NUC, Digital Filter, DDE
Image MirrorVertical / Horizontal / DiagonalVertical / Horizontal / Diagonal
Power Supply4.0–5.5VDC / 3.3V / 1.8V(2)4.0–5.5VDC / 3.3V / 1.8V(2)
Typical Voltage5VDC / 3.3V / 1.8V(2)5VDC / 3.3V / 1.8V(2)
Typical Power1.1W (0.9W)(3)1.2W (1.0W) (3)
Digital Video14/8bit LVCMOS, BT.1120, MIPI(4), USB3.014/8bit LVCMOS, CDS2, MIPI(4), USB3.0
Control InterfaceUART (3.3V)UART (3.3V)
Temp Range-20℃~+150℃; +100℃~+650℃
Temp Accuracy±2℃ or ±2% of reading (whichever is greater) @Ambient temperature 15~35℃
Temp ToolsSpot, line, area analysis
Weight24.5g24.5g
Dimensions29mm×29mm×18.9mm29mm×29mm×18.9mm
Operating Temp-40℃~+70℃-40℃~+60℃
Storage Temp-45℃~+80℃-45℃~+80℃
Humidity5–95%, noncondensing5–95%, noncondensing
Vibration6.06g random, 3axis 6directions6.06g random, 3axis 6directions
Shock80g, 4ms, halfsine, 3axis 6directions80g, 4ms, halfsine, 3axis 6directions

Notes:
(1) Pseudo color not available for LVCMOS.
(2) Power consumption varies with input voltage.
(3) Power tested at 25℃, excluding interface board.
(4) LVCMOS / MIPI only available via Hirose 70pin; thermal module does not output temperature data via MIPI.
(5) Weight/dimensions exclude optics, housing, and extension board.

4. Hardware Interface Description for Thermal Camera Cores Connection

NLIR1280L Thermal Camera Cores Hirose 70pin Connector Layout
Figure 4.1 Core Assembly to User Interface

The module uses a Hirose 70pin DF40C-70DP-0.4V(51) connector, including power, UART, BT.1120, 8/14bit LVCMOS, 2lane MIPI, and 4 GPIOs.

4.1 Hirose 70pin Interface Definition

Table 4.1 Hirose 70pin User Interface Definition

Pin No.NameTypeDescription
1–4Main PowerPower In4–5.5VDC(1)
5,71.8VPower InDigital 1.8V
6,83.3VPower InDigital 3.3V
13UART_TXOutputUART (3.3V)(2)
14UART_RXInput
30DV0Output14/8bit LVCMOS / BT.1120 / CDS2 (1.8V) Data signal LSB
29DV1OutputData signal
32DV2OutputData signal
31DV3OutputData signal
34DV4OutputData signal
33DV5OutputData signal
36DV6OutputData signal
35DV7OutputData signal MSB(8bit)
38DV8OutputData signal
37DV9OutputData signal
40DV10OutputData signal
39DV11OutputData signal
42DV12OutputData signal
41DV13OutputData signal MSB(14bit)
44DV14OutputData signal
43DV15OutputData signal MSB(16bit)
46Frame_ValidOutputFrame Valid Signal
45Line_ValidOutputLine Valid Signal
47Clock_OUTOutputClock Signal
48EXT_SYNCInputExternal sync (3.3V)
15GPIO0I/OGPIO (1.8V)
17GPIO1I/O
58GPIO2I/O
60GPIO3I/O
57MIPI_DATA1+Output2lane MIPI
59MIPI_DATA1-Output
62MIPI_DATA2+Output
64MIPI_DATA2-Output
61MIPI_ CLK+Output
63MIPI_ CLK-Output
16,18,23,24,25,26,51,52,53,54,65,66,67,68N/C, Floating
9–12,19–22,27–28,49–50,55–56,69–70GNDPowerGround(3)

Power Requirements:
Main Power: 4.0–5.5V, typical 5V, max 1A, ripple <40mVpp
1.8V: 1.75–1.85V, max 70mA
3.3V: 3.14–3.46V, max 50mA

NLIR1280L Thermal Camera Cores Power-On Sequence Figure 4.2 Core Power-On Timing Diagram

Table 4.2 Power Supply Requirements

PinVoltage (Min. / Typ. / Max.)Current (Min. / Typ. / Max.)Maximum Ripple Noise
Main Power4.0V / 5V / 5.5V—— / 200mA / 1A40mV
+1.8V1.75V / 1.8V / 1.85V—— / 60mA / 70mA1mV (1Hz~50kHz)
+3.3V3.14V / 3.3V / 3.46V—— / 20mA / 50mA50mV

Note: TX and RX pins of the serial communication interface refer to the transmit and receive signals of the core module assembly respectively.

4.2 Digital Video Output Protocols for Advanced Integrations

Default output:
Imaging: BT.1120
Temperature measurement: CDS2

4.2.1 14bit or 8bit LVCMOS Digital Video

The core module assembly supports 14-bit or 8-bit LVCMOS digital video output. This digital video signal set consists of 1 clock signal (Clock), 1 line valid signal (Line_Valid), 1 frame valid signal (Frame_Valid), and 14 data signals (DV0 to DV13).

There are two pixel data bit depth options: When the user selects to output original (ORG) data or non-uniformity correction (NUC) processed data, the output bit depth is 14-bit, corresponding to data bus DV[13:0]. Among them, DV0 is the least significant bit (LSB), and DV13 is the most significant bit (MSB).

When the user selects to output dynamic range compression (DRC) processed image data, the output bit depth is 8-bit, corresponding to data bus DV[7:0]. Among them, DV0 is the least significant bit (LSB), and DV7 is the most significant bit (MSB). When 8-bit LVCMOS digital video output is enabled, the functions of brightness/contrast adjustment and polarity selection are supported. Pseudo-color conversion and image mirroring functions are not available.

Table 4.2 LVCMOS Clock Frequency

Model No.Clock Frequency
128087.931MHz
14-bit & 8-bit LVCMOS Digital Video Timing Diagram Figure 4.3 14-bit & 8-bit LVCMOS Digital Video Timing Diagram

Note:
(1) It is recommended to sample DV data on the rising edge of the Clock signal.
(2) Both Line_Valid and Frame_Valid signals are active high.
(3) After Line_Valid becomes active, it remains valid for n clock cycles. During this period, DV data is valid sequentially from the 1st column to the last column of the current row.

4.2.2 BT.1120 Timing Diagram

The core module assembly supports 16-bit BT.1120 digital video output. This digital video signal set consists of 1 clock signal (Clock), 1 line valid signal (Line_Valid), 1 frame valid signal (Frame_Valid), and 16 data signals (DV0 to DV15). The pixel data bit depth is 16-bit, with an image resolution of 1280×1024, and the image format is YUV422. The timing diagram is shown below.

Table 4.3 BT.1120 Clock Frequency

Model No.Clock Frequency
128087.931MHz
BT.1120 Synchronization for Thermal Camera Cores Figure 4.4 BT.1120 Digital Video External Synchronization Mode Timing Diagram

Table 4.4 BT.1120 Digital Video Internal Synchronization Mode Timing Structure

Invalid Line EAV CodeBlanking AreaInvalid Line SAV CodeInvalid Data
0xB6B60x80100xABAB0x8010
Active Line EAV CodeBlanking AreaActive Line SAV CodeActive Data Area (CbYCrY)
0x9D9D0x80100x8080Data area resolution of 1280 core module: 1280×1024
Invalid Line EAV CodeBlanking AreaInvalid Line SAV CodeInvalid Data
0xB6B60x80100xABAB0x8010

4.2.3 CDS2 Timing Diagram

The core module assembly supports 16-bit CDS2 digital video output. This digital video signal set consists of 1 clock signal (Clock), 1 line valid signal (Line_Valid), 1 frame valid signal (Frame_Valid), and 16 data signals (DV0 to DV15). The pixel data bit depth is 16-bit, with an overall image resolution of 2560×1024. The left 1280×1024 area adopts the YUV422 image format, while the right 1280×1024 area adopts the Raw16 temperature measurement data format. The timing diagram is shown below.

Table 4.5 CDS2 Clock Frequency

Model No.Clock Frequency
128087.931MHz
CDS2 Radiometric Timing for Thermal Camera Cores Figure 4.5 CDS2 Digital Video Timing Diagram

Note: “Temp” represents temperature data. The valid data occupies the lower 14 bits, and the upper 2 bits are padded with 0.

4.2.4 MIPI Protocol

This product adopts 2-lane MIPI interface. The MIPI interface consists of 1 pair of source-synchronous differential clock signals (MIPI_CLK+, MIPI_CLK-), and 2 pairs of differential data signals (MIPI_DATA0+, MIPI_DATA0-, MIPI_DATA1+, MIPI_DATA1-).

The clock signal enters the High-Speed (HS) mode at the start of each frame, and exits High-Speed mode after each frame transmission is completed. During the inter-frame period, the interface operates in Low-Power (LP) mode (both data lines and clock line remain at 1.2V high level). The clock frequency of this product is 218MHz.

At the beginning of each frame, the data lanes transmit a Frame Start (FS) packet. At the end of each frame, a Frame End (FE) packet is transmitted. Between the Frame Start and Frame End packets, there are 1024 data long packets. Each long packet contains 1280×2 valid data words for one row of image, corresponding to 1280 pixels.

MIPI CSI-2 Frame Structure for Thermal Camera Cores Figure 4.6 Single Frame Data Structure Diagram

After power-on initialization, the core module assembly starts outputting MIPI digital video in RAW8 format (compliant with standard MIPI CSI-2 protocol).

The native output resolution is configured as (1280×2)×1024. The back-end device is required to reassemble the data into 1280×1024×16-bit data, with little-endian byte order (lower byte first).

Valid data per row is image pixel data. When pseudo-color function is enabled, the pixel arrangement follows the UYVY format (UV channel data precedes Y channel data), as illustrated in Figure 4.7.

MIPI Valid Line Schematic for Thermal Camera Cores Figure 4.7 Schematic Diagram of One Line of Valid Data

4.3 User Extension Module Options

Table 4.6 User Extension Modules

ModelProduct IllustrationMain InterfaceCompatible Cores
TLX04V100F016CExtension Module for Thermal Camera CoresUSB3.0 TypeC, 5V1280 Imaging / 1280Temp

5. Mechanical Dimensions and Mounting Blueprint

Module dimensions (without lens): 29mm × 29mm × 18.9mm

NLIR1280L Thermal Camera Cores Physical Blueprint Mount: 4×M1.6

6. Precautions

  • Do not point the module at intense radiation sources such as the sun.
  • Recommended ambient temperature: -20℃ to 50℃.
  • Do not touch or bump the detector window.
  • Do not touch the device or cables with wet hands.
  • Do not bend or damage cables.
  • Do not clean with thinners.
  • Disconnect power before plugging/unplugging cables.
  • Avoid incorrect wiring.
  • Observe ESD protection.
  • Do not disassemble; contact us for service.

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