Infrared Thermal Modules

Home / Infrared Thermal Modules

Infrared Thermal Modules Series Overview

The Infrared Thermal Modules series is engineered to define the next generation of thermal imaging performance, meticulously balancing 12μm and 8μm pixel pitch resolutions with extreme SWaP-C efficiency. From our ultra-miniature <4g NLIR640T core to our high-resolution 1280×1024 imaging solutions, every single uncooled infrared thermal module incorporates proprietary second-generation IR ISP chips and shutterless NUC algorithms. These highly specialized Infrared Thermal Modules are specifically optimized for rapid hardware integration into UAV gimbal systems, industrial inspection robots, and portable night vision devices, providing seamless digital compatibility with MIPI, USB3.0, and GigE AI processing platforms.

  • Resolution Matrix Spectrum: Scales seamlessly from 256×192 entry-level arrays up to 1280×1024 high-definition technical tracking grids.
  • Advanced Detector Geometry: Integrates premium 12μm and 8μm VOx WLP wafer-level package architectures to minimize spatial footprints.
  • Shutterless NUC Algorithms: Implements real-time shutterless non-uniformity correction standards to guarantee continuous thermal visibility.
  • Multi-Protocol Bus Interfaces: Yields flexible system deployment pathways supporting native MIPI, USB3.0, and GigE digital stream outputs.

Infrared Thermal Modules Technical Performance Matrix

ModelResolutionNETDTemp. MeasurementWeightPower
1280×1024≤50mKOptional Version24.5g~1.1W
1280×1024≤35mKSupported170±10g≤5.0W
640×512≤40mKNot specified<4g≤0.4W
640×512≤40mKNot specified<8.6g<0.7W
384×288≤40mKNot specified<7g<0.42W
256×192≤40mKNot specified<7g<0.35W